Apple A20 Pro Adopts WMCM Packaging, NPU Upgraded for iPhone 18 Pro

According to leaked schematics from Reptalica, Apple's A20 Pro processor for iPhone 18 Pro will use TSMC's 2nm process and introduce Wafer-Level Multi-Chip Module (WMCM) packaging for the first time, a shift from the PoP stacking design used in A19 Pro. The new packaging moves DRAM from the top of the SoC to the chip's side, improving heat dissipation and reducing thermal throttling during high-load operation. The A20 Pro will also expand its Neural Engine (NPU) area while maintaining the same overall package size, indicating Apple is prioritizing AI computing capabilities for on-device functions.
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