India Launches First Advanced 3D Chip Packaging Plant in Odisha with $209M Investment

Gate News message, April 20 — India broke ground on its first advanced 3D chip packaging facility in Odisha, with total investment of 19.4 billion rupees (approximately $209 million). The plant, located at Info Valley in Khordha and backed by Intel Capital and Lockheed Martin Ventures, targets commercial production by August 2028 and full-scale output by August 2030.

3D Glass Solutions, a U.S. chip packaging company, is developing the facility to focus on advanced chip packaging and embedded glass substrate ATMP (assembly, test, and packaging). The plant will utilize large-format panel-level processing at 510 mm x 515 mm, moving beyond the company’s existing 150 mm and 200 mm wafer processes in Albuquerque, New Mexico. Glass substrates serve as thin base layers for building and connecting chips, offering improved electrical performance and thermal stability compared to traditional materials, which can reduce signal loss and packaging stress in high-frequency systems such as AI and 5G/6G networks.

The project has secured letters of intent and indicative commitments from major chip designers. Marvell committed to approximately 70,000 panels annually, while Intel committed to more than 10,000 panels per year. Combined offtake indications exceed the planned capacity of 5,800 panels per month (approximately 69,600 annually). The facility aims to serve data centers, high-performance computing, AI applications, and defense electronics, while helping India build domestic capability in advanced packaging materials and 3D heterogeneous integration (3DHI) technologies.